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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM for Dual-Band GSM/GPRS
Applications
* Dual-band cellular handsets encompassing - Class 4 GSM900 - DCS1800 - Class 12 GPRS multi-slot operation
Description
The SKY77518-21 is a transmit and receive front-end module (FEM) with Integrated Power Amplifier Control (iPACTM) for dual-band cellular handsets comprising GSM900 and DCS1800 operation. Designed in a low profile, compact form factor, the SKY77518-21 offers a complete Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching circuitry for 50 input and output impedances, TX harmonics filtering, high linearity and low insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block supports the GSM900 band and the other PA block supports the DCS1800 band. Both PA blocks share common power supply pads to distribute current. The output of each PA block and the outputs to the two receive pads are connected to the antenna pad through PHEMT RF switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of transmit and receive modes are performed using two external control pads. Refer to the functional block diagram in Figure 1 below. The band select pad (BS) selects between GSM and DCS modes of operation. The transmit enable (TX_EN) pad controls receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between the antenna and TX-VCO while the VCO is being tuned prior to the transmit burst. The SKY77518-21 is compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads, depending on the level applied to the VLOGIC pad. This feature provides additional flexibility for the designer in the selection of FEM interface control logic.
Features
* High efficiency - GSM900 48% - DCS 41% * Low transmit supply current - GSM900 1.26 A - DCS1800 0.9 A * Internal ICC sense resistor for iPAC * Closed loop iPAC * 50 matched Input/Output * TX-VCO-to-antenna and antennato-RX-SAW filter RF interface * TX harmonics below -33 dBm * PHEMT RF switches afford high linearity, low insertion loss, and less than 20 A supply current in receive modes * Small outline: 6 mm x 8 mm * Low profile: 1.2 mm * Compatible with multiple logic families * Low APC current: 25 A
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Figure 1. Functional Block Diagram
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
Electrical Specifications
The following tables list the electrical characteristics of the SKY77518-21 Front-End Module. The absolute maximum ratings and recommended operating conditions for the SKY77518-21 are listed in Table 1 and Table 2, respectively. Table 3 specifies the mode control logic and Table 4 contains the electrical characteristics of the SKY77518-21 for modes GSM900 and DCS1800. Figure 2 presents an application schematic for the SKY77518-21. The SKY77518-21 is a static-sensitive electronic device and should not be stored or operated near strong electrostatic fields. Detailed information on device dimensions, pad descriptions, packaging and handling can be found in later sections of this data sheet.
Table 1. Absolute Maximum Ratings
Parameter Input Power (PIN) Supply Voltage (VCC), Standby VRAMP 0.3 V VLOGIC 0.5 V Control Voltage (VRAMP) Storage Temperature Minimum Maximum 15 7 VCC_MAX - 0.2 V (See Table 4) 150 Unit dBm V
-0.5 -55
V C
Table 2. Recommended Operating Conditions
Parameter Supply Voltage (VCC) Supply Current (ICC) Operating Case Temperature (TCASE) 1
1
Minimum 2.7 0 1-Slot (12.5% duty cycle) 2-Slot (25% duty cycle) -20 -20
Typical 3.3
Maximum 4.8 1.8 85 85
Unit V A
Case Operating Temperature refers to the temperature of the GROUND PAD on the underside of the package.
Table 3. SKY77518-21 Mode Control Logic
Mode STANDBY GSM_RX DCS_RX GSM_TX DCS_TX
1
VLOGIC TX_En 0 1 1 1 1 X1 0 0 1 1
Input Control Bits BS X1 0 1 0 1
X = don't care
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Table 4. SKY77518-21 Electrical Specifications 1 (1 of 5)
General Parameter Supply voltage Power control impedance VLOGIC control voltage LOW HIGH VLOGIC current LOW HIGH Band Select current TX_EN control voltage TX_EN current LOW HIGH VCC ZVRAMP VLOGIC_LOW VLOGIC_HIGH IVLOGIC VBS_LOW VBS_HIGH IBS VTX_EN_LOW VTX_EN_HIGH ITX_EN TX_EN 2.7 V VCC 4.8 V VLOGIC = VLOGIC_LOW VRAMP 0.1 V TX_EN 0.4 V BS 0.4 V BS VLOGIC - 0.4 V TCASE = 25 C PIN -60 dBm VCC 4.8 V 1.2 V VLOGIC 2.7 V VRAMP 0.1 V TX_EN 0.4 V BS 0.4 V BS VLOGIC - 0.4 V TCASE = 25 C PIN -60 dBm BS 2.7 V VLOGIC 2.7 V TX_EN 0.4 V BS 0.4 V Symbol Test Condition -0.1 1.2 -0.1 70% VLOGIC -0.1 70% VLOGIC Minimum 2.7 Typical 3.3 300 1 8 8 0.5 VCC 20 30% VLOGIC VLOGIC 20 30% VLOGIC VLOGIC 20 A Maximum 4.8 Units V k V
Band Select control voltage
V A V A
Standby Mode
IQS
2
10
Leakage current
A
Receive Mode
IQRX
15
50
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
Table 4. SKY77518-21 Electrical Specifications 1 (2 of 5)
GSM900 Mode (f = 880 to 915 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage F PIN VRAMP Symbol Test Condition -- -- -- VCC = 3.3 V POUT = 33 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 33 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C VCC = 3.3 V POUT = 33 dBm PIN = 3 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 33 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C VCC = 3.3 V POUT = 5 dBm PIN = 3 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 5 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C BW = 3 MHz 5 dBm POUT 33 dBm VRAMP controlled 6 VCC = 3.3 V TCASE = 25 C PIN = 0 dBm VCC = 2.7 V TX_EN = VTX_EN_HIGH TCASE = -20 C to 85 C PIN = 0 dBm VCC = 4.8 V TX_EN = VTX_EN_HIGH TCASE = -20 C to 85 C PIN = 0 dBm POUT = 5 to 33 dBm VRAMP controlled 6 PIN = 6 dBm VRAMP 0.1 V VLOGIC = VLOGIC _HIGH TX_EN = VTX_EN_LOW Mode = GSM_RX (see Table 3) PIN = 6 dBm VRAMP 0.1 V VLOGIC = VLOGIC _HIGH TX_EN = VTX_EN_HIGH Mode = GSM_TX (see Table 3) 5 dBm POUT 33 dBm Mode = GSM_TX (see Table 3) 5 dBm POUT 33 dBm Mode = GSM_TX (see Table 3) Minimum 880 0 0.2 Typical Maximum 915 6 1.8 Units MHz dBm V
Power Added Efficiency
PAE
41
48
%
Supply Current @ Rated Power
ICC_33 dBm
1.26
1.48
A
Supply Current @ Minimum Power
ICC_5 dBm
--
53
60
mA
Harmonics
2nd to 13th 2f0 to 13f0
-40
-33
dBm
POUT
33.0
33.5
Output power
POUT_MAX LOW VOLTAGE
30.5
31.5
dBm
POUT_MAX HIGH VOLTAGE
30.5
34.5
Input VSWR
IN
1.5:1
2.5:1
POUT_ RX Forward isolation 4
-65
-45 dBm
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POUT_ENABLED_TX
-40
-5
Coupling of GSM900 TX output (f0) to GSM_RX output pad 4 Coupling of GSM900 TX output (2f0, 3f0) to DCS/PCS_RX output pad
CGHI_TX-RX_F0 CGHI_TX-DCS_RX

3 -50
11 -36
dBm dBm
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Table 4. SKY77518-21 Electrical Specifications 1 (3 of 5)
GSM900 Mode (f = 880 to 915 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VRAMP = controlled 2 PIN = min. to max. VCC = 2.7 V to 4.8 V Load VSWR = 12:1, all phase angles All combinations of the following parameters: VRAMP = controlled 2 PIN = min. to max. VCC = 2.7 V to 4.8 V Load VSWR = 20:1, all phase angles At f0 + 20 MHz (935 to 960 MHz) RBW = 100 kHz VCC = 3.3 V 5 dBm POUT 33 dBm TCASE = 25 C At f0 + 10 MHz (925 to 935 MHz) RBW = 100 kHz VCC = 3.3 V TCASE = 25 C 5 dBm POUT 33 dBm At 1805 to 1880 MHz RBW = 100 kHz VCC = 3.3 V TCASE = 25 C 5 dBm POUT 33 dBm Power control dynamic range Control level 5-15 (VCC 3.3 V) Power control variation Control level 16-19 PCV PCDR POUT 13 to 33 dBm TCASE = 25 C POUT 13 to 33 dBm POUT 5 to 11 dBm TCASE = 25 C POUT 5 to 11 dBm Power control slope PCS 5 to 33 dBm GSM900 RECEIVE (f = 925 to 960 MHz) Mode = GSM_RX Parameter Frequency range Insertion Loss, ANT to GSM_RX 4 VSWR ANT, GSM_RX 4 F ILGSM_RX IN, OUT Symbol Test Condition -- -- -- Minimum 925 Typical 1.0 1.2:1 Maximum 960 1.3 1.5:1 Units MHz dB Minimum Typical Maximum Units
Spurious
Spur
No parasitic oscillation > -36 dBm
Load mismatch
Load
No module damage or permanent degradation
-84
-83
RX Band Spurious
RX_SPUR
-80
-76
dBm
-101
-84
30 -1.0 -1.5 -2.0 -3.5
50
1.0 1.5
dB
dB 2.0 3.5 150 dB/V
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
Table 4. SKY77518-21 Electrical Specifications 1 (4 of 5)
DCS1800 Mode ( f = 1710 to 1785 MHz and PIN = 0 to 6 dBm) Parameter Frequency range Input power Analog power control voltage f PIN VRAMP Symbol Test Condition -- -- -- VCC = 3.3 V POUT = 31 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 31 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C VCC = 3.3 V POUT = 31 dBm PIN = 3 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 31 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C VCC = 3.3 V POUT = 0 dBm PIN = 3 dBm TX_EN = VTX_EN_HIGH VRAMP set for POUT = 0 dBm pulse width 577 s duty cycle 1:8 TCASE = 25 C BW = 3 MHz, 0 dBm POUT 31 dBm VRAMP controlled 5 VCC = 3.3 V TCASE = 25 C PIN = 0 dBm VCC = 2.7 V TX_EN = VTX_EN_HIGH TCASE = -20 C to 85 C PIN = 0 dBm VCC = 4.8 V TX_EN = VTX_EN_HIGH TCASE = -20 C to 85 C PIN = 0 dBm POUT = 0 to 31 dBm VRAMP controlled 5 PIN = 6 dBm VRAMP 0.1 V VLOGIC = VTX_EN_HIGH TX_EN = VTX_EN_LOW Mode = DCS_RX (see Table 3) PIN = 6 dBm VRAMP 0.1 V VLOGIC = VLOGIC_HIGH TX_EN = VTX_EN_HIGH Mode = DCS_TX (see Table 3) 0 dBm POUT 31 dBm Mode = DCS_TX (see Table 3) Minimum 1710 0 0.2 Typical Maximum 1785 6 1.8 Units MHz dBm V
Power Added Efficiency
PAE
35
41
%
Supply Current @ Rated Power
ICC_31 dBm
0.93
1.04
A
Supply Current @ Minimum Power
ICC_0 dBm
--
40
55
mA
2nd to 4th, 7th Harmonics 5 ,6
th th
2f0 to 4f0, 7f0 5f0, 6f0 POUT
-- 31.0
-40 -35 32.0
-33 dBm -25
Output power
POUT _MAX LOW VOLTAGE
28.5
30.0
dBm
POUT _MAX HIGH VOLTAGE
28.5
32.5
Input VSWR
IN
1.5:1
2.5:1
POUT RX Forward isolation 4
-65
-53 dBm
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POUT_ENABLED_TX
-35
-5
Coupling of DCS TX output to Receive RF output pad 4
CDCS_TX-RX_F0
2
9
dBm
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Table 4. SKY77518-21 Electrical Specifications 1 (5 of 5)
DCS1800 Mode (f = 1710 to 1785 MHz and PIN = 0 to 6 dBm) [continued] Parameter Symbol Test Condition All combinations of the following parameters: VRAMP = controlled 3 PIN = min. to max. VCC = 2.7 V to 4.8 V Load VSWR = 12:1, all phase angles All combinations of the following parameters: VRAMP = controlled 3 PIN = min. to max. VCC = 2.7 V to 4.8 V Load VSWR = 20:1, all phase angles At f0 + 20 MHz (1805 to 1880 MHz) RBW = 100 kHz VCC = 3.3 V TCASE = 25 C 0 dBm POUT 31 dBm 925 to 960 MHz RBW = 100 kHz VCC = 3.3 V TCASE = 25 C 0 dBm POUT 31 dBm Power control dynamic range Control level 0-8 VCC 3.3 V PCDR POUT 14 to 31 dBm TCASE = 25 C POUT 14 to 31 dBm POUT 4 to 12 dBm TCASE = 25 C POUT 4 to 12 dBm POUT 0 to 2 dBm TCASE = 25 C POUT 0 to 2 dBm Power control slope PCS 0 to 30 dBm DCS 1800 RECEIVE (f =1805 to 1880 MHz) Mode = DCS_RX Parameter Frequency range Insertion Loss, ANT to DCS_RX 4 VSWR ANT, DCS_RX 4
1
Minimum
Typical
Maximum
Units
Spurious
Spur
No parasitic oscillation > -36 dBm
Load mismatch
Load
No module damage or permanent degradation
-83
-78 dBm
RX Band Spurious
RX_SPUR
-87
35 -1.5 -2.0 -2.5 -3.5 -3.0 -4.5
50
1.5 2.0 2.5
dB
Power control variation
Control level 9-13
PCV
dB 3.5 3.0 4.5 150 dB/V
Control level 14-15
Symbol f ILDCS_RX IN, OUT
Test Condition -- -- --
Minimum 1805
Typical 1.2 1.2:1
Maximum 1880 1.5 1.5:1
Units MHz dB
Unless specified otherwise: TCASE = -20 C to max. operating temperature (see Table 2), RL = 50 , pulsed operation with pulse width 1154 s and duty cycle 2:8, VCC = 2.7 V to 4.8 V. ICC = 0A to xA, where x = current at POUT = 33 dBm, 50 load, and VCC = 3.3 V. ICC = 0A to xA, where x = current at POUT = 31 dBm, 50 load, and VCC = 3.3 V Terminate all unused RF ports with 50 loads Max VRAMP = VRAMP @ POUT =31 dBm, 50 load, TCASE 25 C, PIN = 3 dBm Max VRAMP = VRAMP @ POUT =33 dBm, 50 load, TCASE 25 C, PIN = 3 dBm
2 3
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5 6
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
Figure 2. SKY77518-21 Application Schematic Diagram
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Package Dimensions and Pad Descriptions
Figure 3 is a mechanical diagram of the pad layout for the SKY77518-21, a 20-pad leadless dual-band FEM. Figure 4 provides a recommended phone board layout footprint for the FEM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 5 illustrates the device pad configuration and the numbering convention which starts with pad 1 at the upper left, as indicated, and increments counter-clockwise around the package. Table 5 lists the pad names and the associated signal descriptions. Figure 6 interprets typical case markings.
6 PAD 1 INDICATOR 0.5 0.05 B C
0.5 0.075 METAL PAD EDGE (0.1) DETAIL A PAD SCALE: 2X THIS ROTATION ROTATED 180 THIS ROTATED 90 CW THIS ROTATED 90 CCW
8
6X 6X 4X 4X
(0.2 X 45)
DETAIL B SCALE: 2X
0.15 A B C
TOP VIEW
2.1 0 2.1 PAD 20 PAD 1 PAD 1 INDICATOR SEE DETAIL B
2.2
0 4X 0.5 1.8 4X 1.5 SOLDER MASK OPENING 0.2 A B C A 1.15 0.1 0.1 4X 2.5 4X 1.5 4X 0.5 20X SMT PAD SEE DETAIL A 0.15 A B C
SIDE VIEW
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BOTTOM VIEW
NOTES: UNLESS OTHERWISE SPECIFIED.
1. Dimensioning and Tolerancing in accordance with ASME Y14.5-1994. 2. Pads are solder mask defined on 3 edges. 3. All dimensions are in millimeters.
200472_003
Figure 3. SKY77518-21 FEM Package Dimensions - 20-Pad Leadless (All Views)
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
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Figure 4. Phone PCB Layout Footprint for 6 x 8 mm, 20-Pad Package with Grid-Bottom Solder Mask - SKY77518-21 Specific.
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
GSM_IN
17 10
DCS_IN
VBATT
GND
1
20
19
18
16
VLOGIC VRAMP TX_EN BS
2 3 4 5 GROUND PAD
6
7
8
9
11
GND
GND
GND
DCS_RX
Pin layout as seen from top view looking through the package.
200472_005
GSM_RX
ANT
GND
15 GND 14 GND 13 GND 12 GND
NC
Figure 6. Typical Case Markings Figure 5. SKY77518-21 FEM Package Pad Configuration - 20Pad Leadless (Top View)
Table 5. SKY77518-21 Pad Names and Signal Descriptions
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Name VBATT VLOGIC VRAMP TX_EN BS DCS_RX GSM_RX GND GND GND ANT GND GND GND GND GND GSM_IN NC Description Battery input voltage Control logic level selection/Standby control Analog power control voltage input TX / RX select (mode control) Band Select (mode control) DCS Receive RF Output (1805-1880 MHz) GSM Receive RF Output (920-960 MHz) RF and DC Ground RF and DC Ground RF and DC Ground RF_IN / RF_OUT to Antenna RF and DC Ground RF and DC Ground RF and DC Ground RF and DC Ground RF and DC Ground RF input 880-915 MHz No Connect RF input 1710-1785 MHz RF and DC Ground Ground Pads, module underside
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77518-21 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Joint Industry Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format (see Figure 7). For additional packaging details, refer to Skyworks Application Note: Tape and Reel Information - RF Modules, Document Number 101568.
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19 20 DCS_IN GND
GND PADS GROUND GRID
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DATA SHEET
SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
Figure 7. Tape and Reel Dimensional Diagram for 6 x 8 x 1.2 mm Package SKY77518-21 Specific
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SKY77518-21 TX-RX iPACTM FEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Electrostatic Discharge Sensitivity
The SKY77518-21 is a Class 1 device. The ESD testing was performed in compliance with JEDEC JESD22-A114B Human Body Model (HBM) and JEDEC JESD22-A115B Machine Model (MM) requirements. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards that fail devices only after "the pad fails the electrical specification limits" or "the pad becomes completely non-functional". * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors Skyworks employs stringent criteria, rejecting devices as soon as the pad begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 1 ESD handling precautions listed below.
* Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
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Ordering Information
Model Number SKY77518-21 Manufacturing Part Number SKY77518-21 Product Revision Package 6x8 MCM-20 Operating Temperature -20 C to +85 C
Revision History
Revision A Level Date November 6, 2007 Initial Issue Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel Information - RF Modules, Document Number 101568 Application Note: BiCMOS iPACTM Front-End Modules Implementation, Document Number 200576 Application Note: SKY77517 / SKY77518 Evaluation Board Information, Document Number 200574 Standard SMT Reflow Profiles: JEDEC Standard J-STD-020 JEDEC JESD22-A114B Human Body Model (HBM) JEDEC JESD22-A115B Machine Model (MM)
(c)2007, Skyworks Solutions, Inc. All Rights Reserved Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS(R) PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks(R) products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks(R) products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks symbol, and "Breakthrough Simplicity"(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
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